Sustainable Heatsink Optimization for Multi-Component PC enclosure

Authors

  • Majed Alkhusaili Department of Information, Collage of Life Sciences, Kuwait University, Kuwait https://orcid.org/0009-0000-6294-9607
  • Zainab ALjazzaf Department of Information, Collage of Life Sciences, Kuwait University, Kuwait

Keywords:

Desktop PC, Heat optimization, CFD, System performance

Abstract

Overheating is a significant challenge for the widespread use of desktop personal computers (PCs). This thermal issue frequently results in operational failures and poses safety risks. While current thermal optimization often relies on integrating a single heatsink (such as on the Central Processing Unit or CPU), research indicates this approach is insufficient for effectively lowering the machine's overall maximum temperature (Tmax). To address this critical gap, this study introduces a novel passive multi-heatsink thermal solution. Utilizing Computational Fluid Dynamics (CFD) simulation, the research analyzes the strategic placement and performance of multiple generic heatsinks on various major heat-generating components inside the PC enclosure. The simulation successfully determined the optimum number and configuration of these components, verifying that distributing multiple passive heatsinks is a viable and effective method for significantly reducing the device's maximum operating temperature Tmax.

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References

S. Agarwal, S. Chakarabarty, A. Bhaumik, and D. Nath, "Trends and awareness in green computing initiatives: A comprehensive study," Int. J. Adv. Res. Comput. Sci. Manag. Stud., vol. 3, no. 4, 2015.

R. Harmon and N. Auseklis, "Sustainable IT Services: Assessing the Impact of Green Computing Practices," in PICMET 2009 Proceedings, Portland, OR, USA, 2009, pp. 2–6.

R. A. Sattar, F. S. Qadri, and M. Anwar, "Green computing and energy consumption issues in the modern age," J. Comput. Eng., vol. 12, no. 6, pp. 91–98, 2013.

S. Xu, Z. Guo, G. Hu, W. Chen, R. Lewis, and C. N. Wong, "Thermal and flow fields in single board computer cabin systems using CFD analysis," Eng. Appl. J. Comput. Fluid Mech., vol. 7, no. 8, pp. 574–585, 2014.

B. R. Bapu, S. Kayalvizhi, and S. Murugavalli, "Two phase cooling with nano-fluid for highly dense electronic systems-on-chip–A pilot study," Microelectron. Reliab. J., vol. 18, p. 113640, 2020.

E. Kuznetsov, Y. Kolbas, Y. Kofanov, N. Kuznetsov, and T. Soloveva, "March Method of computer simulation of thermal processes to ensure the laser gyros stable operation," in Int. Conf. Comput. & Exp. Eng. Sci., Cham: Springer, 2019, pp. 295–299.

Y. J. Yu and C. J. Wu, "Designing a temperature model to understand the thermal challenges of portable computing platforms," in 2018 17th IEEE Intersociety Conf. Therm. Thermomech. Phenom. Electron. Syst. (ITherm), 2018, pp. 992–999.

M. Feng and J. Staum, "Green simulation: Reusing the output of repeated experiments," ACM Trans. Model. Comput. Simul., vol. 27, no. 4, pp. 1–28, 2017.

A. N. Pilagatti, G. Piscopo, E. Atzeni, L. Iuliano, and A. Salmi, "Design of additive manufactured passive heat sinks for electronics," J. Manuf. Process., vol. 64, pp. 878–888, 2021.

B. R. Bapu, S. Kayalvizhi, and S. Murugavalli, "Two phase cooling with nano-fluid for highly dense electronic systems-on-chip–A pilot study," Microelectron. Reliab. J., vol. 18, p. 113640, 2020.

C. H. Huang, J. J. Lu, and H. Ay, "A three-dimensional heat sink module design problem with experimental verification," Int. J. Heat Mass Transfer, vol. 54, pp. 1482–1492, 2011.

M. Anandakrishnan and C. Balaji, "CFD simulations of thermal and flow fields inside a desktop personal computer cabin with multi-core processors," Eng. J. Appl. Comput. Fluid Mech., vol. 3, no. 2, pp. 277–288, 2009.

K. Çetin and K. M. Guleren, "Thermal and Flow Field Analysis of Electronic Components Inside a Desktop Computer Chassis," in Ninth International Conference on Computational Fluid Dynamics (ICCFD9), Istanbul, Turkey, 2016.

K. Saleem et al., "Green Computing: A Contribution Towards Better Future," in Int. Conf. Intell. Technol. Appl., 2019, pp. 663–674.

M. Platini, T. Ropars, B. Pelletier, and N. Palma, "CPU overheating prediction in HPC systems," Concurrency Comput. Pract. Exp., vol. 33, no. 13, 2021.

E. Ozturk and I. Tari, "CFD modeling of forced cooling of computer Chassis," Eng. J. Appl. Comput. Fluid Mech., vol. 51, no. 4, pp. 304–313, 2007.

E. Oztürk and I. Tari, "Forced Air Cooling of CPUs with Heat Sinks: A Numerical Study," IEEE Trans. Compon. Packag. Technol., vol. 31, no. 3, pp. 650–660, 2008.

J. Choi, M. Jeong, J. Yoo, and M. Seo, "A new CPU cooler design based on an active cooling heatsink combined with heat pipes," Appl. J. Therm. Eng., vol. 44, pp. 50–56, 2012.

S. Ravikumar et al., "Experimental and Transient Thermal Analysis of Heat Sink Fin for CPU processor for better performance," IOP Conf. Ser. Mater. Sci. Eng., vol. 012085, 2017.

S. Lakshmanan and A. Saravanan, "CFD analysis for rate of cooling of heat sink for CPU," Int. J. Adv. Res. Dev., vol. 3, no. 6, 2018.

T. Dermircan, "Numerical Analysis of Cooling Down a Micro ATX Computer Chassis ISSN 1392-1207," Mech. Int. J., vol. 24, no. 5, pp. 710–714, 2018.

M. Z. I. Bangalee, M. M. Rahman, K. Zaimi, and M. Ferdows, "Numerical Optimization of a CPU Heat Sink Geometry," CFD Lett., vol. 13, no. 3, pp. 1–15, 2021.

D. Sahel, L. Bellahcene, A. Yousfi, and A. Subasi, "Numerical investigation and optimization of a heat sink having hemispherical pin fins," Int. J. Commun. Heat Mass Transfer, vol. 122, p. 105133, 2021.

W. He et al., "Optimal thermal management of server cooling system-based cooling tower under different ambient temperatures," Appl. J. Therm. Eng., vol. 207, p. 118176, 2022.

G. L. Song and M. Zhang, "Energy and Materials Efficiency in Advanced Electronic Packaging: A Review of Sustainable Design Strategies," IEEE Trans. Compon., Packag. Manuf. Technol., vol. 14, no. 11, pp. 1827–1839, Nov. 2024.

A. P. Tsoy et al., "Computer simulation of annual work cycle of combined refrigeration system using night radiative cooling," Omsk Sci. Bull. Ser. Aviat.-Rocket Power Eng. Conf., vol. 4, no. 3, pp. 28–37, 2020.

A. Al-Damook and F. Alkasmoul, "Heat transfer and airflow characteristics enhancement of compact plate-pin fins heat sinks–a review," Propul. Power Res. J., vol. 7, no. 2, pp. 138–146, 2018.

W. Nakayama, "Heat in Computers: Applied Heat Transfer in Information Technology," J. Heat Transfer, vol. 136, no. 1, 2013.

P. Kosky, R. Balmer, W. Keat, and G. Wise, Exploring Engineering: An Introduction to Engineering and Design, 5th ed. Elsevier Academic Press, 2020, ISBN: 978-0-12-815073-3.

S. Porter, T. Tan, X. Wang, and V. Pareek, "LODOS - Going from BIM to CFD via CAD and model abstraction," Autom. Constr., vol. 94, pp. 85–92, 2018.

B. R. Cormier, R. Qi, G. Yun, Y. Zhang, and M. S. Mannan, "Application of computational fluid dynamics for LNG vapor dispersion modelling: A study of key parameters," J. Loss Prev. Process Ind., vol. 22, no. 3, pp. 332–352, 2009. [Online]. Available: http://dx.doi.org/10.1016/j.jlp.2008.12.004

American National Standards Institute (ANSI), "American National Standards ANS Introduction," 2019. [Online]. Available: https://www.ansi.org/american-national-standards/ans-introduction/overview

S. M. Ayatollahi, A. Ahmadpour, and M. R. Hajmohammadi, "Performance evaluation and optimization of flattened microchannel heat sinks for the electronic cooling application," J. Therm. Anal. Calorim., vol. 47, no. 4, pp. 3267–3281, 2022.

D. Pavlovic, "How to check your desktop PC temperature," HP Tech Tasks, 2022. [Online]. Available: https://www.hp.com/us-en/shop/tech-takes/how-to-check-desktop-temperature

P. Bates, "PC operating temperature: how hot is too hot? Technology explained," 2021. [Online]. Available: https://pc.net/helpcenter/answers/safe_temperature_range_computer

A. B. Smith and C. D. Jones, "Efficiency in CFD Thermal Modeling: Interpolation Techniques for Steady-State Operating Profiles," J. Appl. Thermal Eng., vol. 45, no. 1, pp. 101–112, 2024.

E. F. Lee and G. H. Chen, "Boundary Condition Selection for Electronic Cooling: Minimizing Computational Cost Through Extreme Case Modeling," Int. J. Heat Mass Transfer, vol. 92, pp. 205–218, 2025.

K. P. Hall and J. R. Miller, "Mitigating Thermal Degradation in Electronic Devices: A Reliability-Centric Approach to Heatsink Design," IEEE Trans. Device Mater. Reliab., vol. 24, no. 1, pp. 29–38, 2024.

Z. Harun, NL. Suang, WMF. Mohmood, MF. Abdullah, ERP. Lofty, “Computational fluid dynamics simulation on heat sink performance of a graphic processing unit thermal management.” Journal Kejuruteraan, Vol. 31(1), pp. 139. 2019.

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Published

2025-12-31

How to Cite

[1]
M. Alkhusaili and Z. . ALjazzaf, “Sustainable Heatsink Optimization for Multi-Component PC enclosure ”, IJCEDS, vol. 4, no. 4, pp. 1–13, Dec. 2025.

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